Shenzhen Huafu Fast Multilayer Circuit Co. LTD

Shenzhen Huafu Fast Multilayer Circuit Co. LTD

Manufacturer from China
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2 Years
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6oz Surface Mount PCB Design And Development Assembly Bulk Production

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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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City:shenzhen
Country/Region:china
Contact Person:MsYoyo
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6oz Surface Mount PCB Design And Development Assembly Bulk Production

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Brand Name :HF
Model Number :customization
Certification :ISO CE
Place of Origin :China
MOQ :5PCS
Price :Negotiable
Packaging Details :Paper Carton
Material :FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola and so on
Board layers :1-12
Board thickness :0.4-3.2
Copper Thickness :0.5-4oz
Minimum hole size :0.15mm
Minimum line width/gap :3.5/4mil
Solder Mask color :green, yellow,white, blue,black,red
Silkscreen color :white,black
Payment Terms :L/C, T/T,PAYPAL
Delivery Time :5~8 days
Layer Coun :1-40
Surface Finishing :HASL(lead Free) / Immersion Gold(ENIG) /OSP/ Immersion Tin/Immersion Silver
Service :OEM/ODM/PCB/Components Sourcing/Assembly/Programming/Testing...One-stop Turnkey Service.
Test :100% AOI, X-ray, Flying probe test.
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Capability

 High precision prototypePCB bulk production
Max Layers1-28 layers1-14 layers
MIN Line width(mil)3mil4mil
MIN Line space(mil)3mil4mil
Min via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mm
Board thickness≤2.5mm0.2mm0.3mm
Board thickness>2.5mmAspect Ration≤13:1Aspect Ration≤13:1
Aspect RationAspect Ration≤13:1Aspect Ration≤13:1
Board thicknessMAX8mm7mm
MIN2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size610*1200mm610*1200mm
Max copper thickness0.5-6oz0.5-6oz
Immersion Gold/
Gold Plated Thickness
Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”
 
Hole copper thick25um 1mil25um 1mil
ToleranceBoard thicknessBoard thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance±10%±10%
MIN Solder mask bridge 0.08mm 0.10mm
Plugging Vias capability 0.25mm--0.60mm 0.70mm--1.00mm
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