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Shenzhen Huafu Fast Multilayer Circuit Co. LTD

Shenzhen Huafu Fast Multilayer Circuit Co. LTD

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2 Years
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Home / Products / PCB Circuit Board / Copper Substrate Prototype PCB Assembly board For Thermoelectric Separation /

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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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Copper Substrate Prototype PCB Assembly board For Thermoelectric Separation
Copper Substrate Prototype PCB Assembly board For Thermoelectric Separation
  • Copper Substrate Prototype PCB Assembly board For Thermoelectric Separation
  • Copper Substrate Prototype PCB Assembly board For Thermoelectric Separation
Products Detailed
Capability 　 High precision prototype PCB bulk production Max Layers 1-28 layers 1-14 layers MIN Line width(mil) 3mil 4mil MIN Line space(mil) 3mil ...
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Product Tags:
insb wafer multilayer ceramic capacitors mlcc cem-1 copper clad laminate

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